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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data Issued Date : 2000.12.01 Revised Date : 2001.01.01 Page No. : 1/3
HM772A
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HM772A is designed for use in output stage of amplifier, voltage regulator, DC-DC converter and driver.
Absolute Maximum Ratings
* Maximum Temperatures Storage Temperature ....................................................................................................... -55 ~ +150 C Junction Temperature ............................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ........................................................................................1 W (Note1) Total Power Dissipation (Ta=25C)........................................................................................ 2 W (Note2) Total Power Dissipation (Ta=25C)..................................................................................... 1.5 W (Note3) * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage.................................................................................................... -60 V VCEO Collector to Emitter Voltage................................................................................................. -50 V VEBO Emitter to Base Voltage......................................................................................................... -5 V IC Collector Current (continuous) ..................................................................................................... -3 A IC Collector Current (pulse) ................................................................................................. -7 A (Note4)
Note1: When tested in free air condition, without heat sinking. Note2: When mounted on a 40X40X1mm ceramic board. Note3: Printed circuit board 2mm thick, collector plating 1cm square or larger. Note4: Single pulse PW=1ms
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. -60 -50 -5 30 100 Typ. -0.3 -1 160 80 55 Max. -1 -1 -0.5 -2 500 Unit V V V uA uA V V Test Conditions IC=-100uA IC=-1mA IE=-10uA VCB=-30V VEB=-3V IC=-2A, IB=-0.2A IC=-2A, IB=-0.2A VCE=-2V, IC=-20mA VCE=-2V, IC=-1A VCE=-5V, IC=-100mA, f=100MHz VCB=-10V, f=1MHz
*Pulse Test : Pulse Width 380us, Duty Cycle2%
MHz pF
Classification Of hFE2
Rank Range Q 100-200 P 160-320 E 250-500
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 10
Spec. No. : Preliminary Data Issued Date : 2000.12.01 Revised Date : 2001.01.01 Page No. : 2/3
Saturation Voltage & Collector Current
VCE=2V
100
Saturation Voltage (V)
1 VBE(sat) @ IC=10IB
hFE
10
0.1
VCE(sat) @ IC=10IB 1 0.01 0.1 1 10 100 1000 10000 0.01 0.01 0.1 1 10 100 1000 10000
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
1000 1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
Capacitance (pF)
100
100
VCE=5V
Cob 10
10
1 0.1 1 10 100
1 1 10 100 1000
Reverse-Biased Voltage (V)
Collector Current (mA)
Power Derating
1200
Safe Operating Area
10000
1000
Power Dissipation-PD(mW)
Collector Current-IC (mA)
1000
PT=1ms PT=100ms
800
600
100
PT=1s
400
10
200
0 0 20 40 60 80 100
o
1
120 140 160
1
10
100
Ambient Temperature-Ta( C)
Forward Biased Voltage-VCE (V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Marking :
Spec. No. : Preliminary Data Issued Date : 2000.12.01 Revised Date : 2001.01.01 Page No. : 3/3
C
H
Date Code Part Number
HSMC Logo Package Code
B 1 E F G A 2 3
D
Style : Pin 1.Base 2.Collector 3.Emitter
I
3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code : M
*:Typical
DIM A B C D E
Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201
Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51
DIM F G H I
Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161
Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41
Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification

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